Double-sided sputtering and electron beam evaporation combined vacuum roll coating system - efficient and precise thin film coating technology

This vacuum coater is an advanced equipment for coating under high vacuum conditions. It combines double-sided sputtering and electron beam evaporation technology, and can efficiently and accurately deposit thin films on the surfaces of different substrates. It is widely used in the manufacture of metal coatings such as copper and aluminum. Through this system, high-quality coating of double-sided copper and aluminum coatings can be achieved, which is particularly suitable for large-scale production needs. The production capacity of this system can reach about 710,000 square meters per month, which can efficiently meet the needs of large-scale production. Its effective coating width is 1300mm, and the line speed is up to 15 meters per minute. It can achieve uniform and high-precision thin film deposition during the coating process. Whether it is mass production or high-precision products, it can provide stable and efficient performance.

The coating process combines electron beam evaporation and sputtering technology. In a vacuum environment, high-energy electrons or lasers bombard the target material, so that its surface atoms or ions are deposited on the substrate in the form of vapor deposition, forming a thin film with excellent performance. Electron beam evaporation is a technology that forms a thin film on a substrate by heating a target material with an electron beam and evaporating it. In this process, the electron beam is accelerated to a very high energy level and then focused on the surface of the target material. The target material is quickly heated to the evaporation point, and the atoms or molecules on the surface are released in gaseous form and deposited on the cooled substrate to form a thin film. Sputtering technology is a technology that bombards the target material with high-energy particles, so that the surface atoms or ions are released in the form of atomic clusters and deposited on the substrate. Usually, the sputtering process is carried out in a low-pressure atmosphere, using ions or electron beams to bombard the target material, so that the atoms on the surface of the target material are detached and form a thin film. In the coating process, electron beam evaporation technology can efficiently deposit the metal layer, while sputtering technology can achieve uniform deposition of functional thin films. The combination of the two can significantly improve production efficiency, reduce material waste and reduce costs.

The composition of the film layer includes an adhesion layer (SP), an electrode layer copper (evaporation) and a protective layer (SP), which ensures high adhesion and stable electrical conductivity of the film. To ensure the high performance of the film, the equipment provides precise film thickness control, with a film thickness distribution accuracy of ±10%, which is essential for demanding applications. Precise film thickness control ensures uniformity of the film in different areas, avoiding differences in conductivity or other quality problems caused by uneven film layers. In addition, the film resistance can be controlled at 25mΩ, which is much lower than the resistance of many traditional materials, ensuring that the coating has extremely high conductivity. By precisely controlling the resistance, it can be ensured that the product maintains excellent conductivity during long-term use, avoiding equipment efficiency decline or failure due to excessive resistance.

The equipment can be coated on a variety of substrates, including PET/PP films, with a thickness range of 3μm to 12μm. Whether it is flexible electronics, solar cells, touch screens, sensors and other fields, it can provide high-quality coating effects. The operating air pressure of the system is maintained in a low pressure range of 0.005 to 0.01Pa, ensuring precise coating processing in a vacuum environment. At the same time, it is equipped with ion bombardment surface treatment technology to further improve the adhesion between the film layer and the substrate, ensuring the durability and high performance of the coating.