High vacuum plasma sputtering coating equipment: core equipment that enables metallization of DPC ceramic substrate

The semiconductor ceramic substrate coating equipment adopts the principle of high vacuum electric field plasma sputtering, injects a small amount of argon gas into a closed cavity, and ionizes it into an argon ion flow under the action of high voltage. These high-energy argon ions will be accelerated and bombard the target material in a direction, so that the atoms on the surface of the target material are "sputtered" out and evenly deposited on the surface of the ceramic substrate, thereby forming a copper-metal composite layer with a dense structure and strong adhesion.
Semiconductor ceramic substrate coating equipment is a key pre-link in the DPC ceramic substrate processing technology, laying a solid foundation for subsequent circuit manufacturing, graphic transfer and functional integration. Through high-precision metal layer deposition, the ceramic substrate not only achieves excellent conductivity, but also has stronger thermal stability and mechanical strength, fully meeting the stringent requirements of high-end applications such as 5G communications, automotive electronics, and power modules for substrate performance.
During the metal layer deposition process, any impurities will seriously affect the structural stability, electrical properties and adhesion of the deposited layer. Therefore, this equipment is equipped with a high vacuum packaging chamber system, and the vacuum degree can reach 10⁻⁵ Pa level. Through the linkage of high-efficiency molecular pump and mechanical pump for exhaust, multi-layer sealing structure, gas leakage is prevented, the inner wall of the chamber is polished, and adsorption residues are reduced, so as to ensure the purity of the deposition environment and no oxidation reaction from the source, thereby greatly improving the density and uniformity of the metal layer, which is especially suitable for semiconductors and ceramic substrates for high-power devices with extremely high requirements for purity and consistency.
This equipment adopts a precision-controlled plasma ion source system, which can automatically adjust according to different target materials, target thickness, substrate shape and position. This highly controllable ion source structure can achieve a more uniform sputtering distribution of metal atoms, ensuring that the thickness uniformity and surface consistency error of the metal composite layer on the surface of the entire ceramic substrate is less than ±3%, which is especially suitable for the stable production of large-size or special-shaped ceramic substrates.
In order to meet customers' processing needs for ceramic substrates of different specifications, Semiconductor ceramic substrate coating Equipment adopts a modular structure design, which can flexibly replace the substrate fixture, and the expansion interface supports a dual-station or multi-cavity parallel layout.
The control system can preset a variety of process parameters and quickly switch product batches. This structure not only improves the flexibility of equipment use, but also greatly reduces the machine adjustment time and manual intervention costs when switching product models. It is very suitable for OEM, scientific research trial production and mass production compatible and parallel production environments.
Semiconductor ceramic substrate coating Equipment power supply system adopts high-efficiency switching power supply + energy-saving control logic, and the energy consumption is reduced by 15%-30% compared with traditional ion plating equipment. At the same time, it has automatic start-stop and standby optimization mechanism, automatic power adjustment after process stabilization, and reduces excessive energy consumption. Multi-cavity linkage optional configuration can achieve 24-hour uninterrupted continuous production. It is especially suitable for ceramic substrate mass production customers who are sensitive to unit output energy consumption and have high requirements for beat efficiency, such as new energy vehicles, 5G communication equipment and power module manufacturers.